Patent Assignment
Reel/Frame 057607/0032
Assignment of Assignor's Interest
Recorded: 2021-09-27
Pages: 5
Assignors
CHU, KUNMO
Executed: 2021-09-13
SONG, BYONGGWON
Executed: 2021-09-14
LEE, JUNGHOON
Executed: 2021-09-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Hybrid Bonding Structures, Semiconductor Devices Having the Same, and Methods of Manufacturing the Semiconductor Devices