Patent Assignment
Reel/Frame 057609/0439
Assignment of Assignor's Interest
Recorded: 2021-09-27
Pages: 6
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Method for Recessing a Fill Material Within Openings Formed on a Patterned Substrate