Assignment of Assignor's Interest

Recorded: 2021-09-27 Pages: 26

Assignors

DEGAI, MOTOMU

Executed: 2021-08-26

NAKATANI, KIMIHIKO

Executed: 2021-09-07

NAKAGAWA, TAKASHI

Executed: 2021-08-24

WASEDA, TAKAYUKI

Executed: 2021-08-25

Assignee

KOKUSAI ELECTRIC CORPORATION

3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN

Covered Property (1)

Method of Manufacturing Semiconductor Device, Method of Processing Substrate, Substrate Processing Apparatus, and Recording Medium

Application: 17/477,058 →

Publication: US 2022/0005685