Patent Assignment
Reel/Frame 057631/0137
Assignment of Assignor's Interest
Recorded: 2021-09-28
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Manufacturing a via and a Metal Wiring for a Semiconductor Device