Patent Assignment
Reel/Frame 057652/0822
Assignment of Assignor's Interest
Recorded: 2021-09-30
Pages: 2
Assignors
KURODA, TAKAHIRO
Executed: 2020-07-03
NAGOYA, TOMOHIRO
Executed: 2020-07-03
TOMORI, NAOKI
Executed: 2020-07-03
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Temporary Protective Film for Semiconductor Encapsulation Molding, Lead Frame Provided with Temporary Protective Film, Encapsulated Molded Body Provided with Temporary Protective Film, and Method for Manufacturing Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Sep 30, 2021
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 057675/0650 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →