Patent Assignment
Reel/Frame 057658/0238
Assignment of Assignor's Interest
Recorded: 2021-09-30
Pages: 4
Assignors
MIN, JAE SIK
Executed: 2021-09-16
LEE, JAE YEOP
Executed: 2021-09-16
PARK, JAE SUK
Executed: 2021-09-16
CHO, BYOUNG GU
Executed: 2021-09-16
Assignee
LIGHTIZER CO., LTD.
(CHANGDUK DONG, YONGIN TECHNO VALLEY KNOWLEDGE INDUSTRY CENTER), A907-HO, A-DONG A906-HO, 357, GUSEONG-RO, GIHEUNG-GU, YONGIN-SI GYEONGGI-DO, 16914, KOREA, REPUBLIC OF
Covered Property
(1)
Light Emitting Diode Chip-Scale Package with Extended Pad and Method for Manufacturing Same
Application:
17/600,403 →
Publication:
US 2022/0199882
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.