Patent Assignment
Reel/Frame 057663/0903
Assignment of Assignor's Interest
Recorded: 2021-10-01
Pages: 6
Assignors
WENG, CHUNG-MING
Executed: 2021-06-07
YU, CHEN-HUA
Executed: 2021-06-07
LIU, CHUNG-SHI
Executed: 2021-06-07
TSAI, HAO-YI
Executed: 2021-06-07
HSIEH, CHENG-CHIEH
Executed: 2021-06-08
KUO, HUNG-YI
Executed: 2021-06-18
HSU, CHE-HSIANG
Executed: 2021-06-07
JOU, CHEWN-PU
Executed: 2021-06-07
KUO, FENG-WEI
Executed: 2021-06-07
HSU, MIN-HSIANG
Executed: 2021-07-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Having Photonic and Electronic Dies and an Optical Fiber Assembly Creating an Air Gap