Patent Assignment
Reel/Frame 057672/0030
Assignment of Assignor's Interest
Recorded: 2021-10-01
Pages: 4
Assignors
YANG, TING-LI
Executed: 2021-09-30
TSAI, PO-HAO
Executed: 2021-08-23
HSIAO, CHING-WEN
Executed: 2021-08-23
SHUE, HONG-SENG
Executed: 2021-08-23
CHENG, MING-DA
Executed: 2021-08-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Bump Integration with Redistribution Layer