Patent Assignment
Reel/Frame 057672/0210
Assignment of Assignor's Interest
Recorded: 2021-10-01
Pages: 5
Assignors
YAO, ANBANG
Executed: 2019-06-13
ZHANG, JIAHUI
Executed: 2019-06-13
SUN, DAWEI
Executed: 2019-06-13
GU, DIAN
Executed: 2019-06-12
CHEN, YURONG
Executed: 2019-06-13
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
A Generic Modular Sparse Three-Dimensional (3D) Convolution Design Utilizing Sparse 3D Group Convolution
Application:
17/435,657 →
Publication:
US 2022/0147791