Patent Assignment
Reel/Frame 057687/0372
Change of Name
Recorded: 2021-09-30
Pages: 4
Assignor
VOIDFORM PRODUCTS, INC.
Executed: 2021-03-05
Assignee
VOIDFORM PRODUCTS, LLC
750 W HAMPDEN AVE., ENGLEWOOD, COLORADO, 80110
Covered Property
(1)
Modular Void Form Structure
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 30, 2021
From: GATES, JOHN WOODSON; DIEHL, TODD ANDREW
To: VOIDFORM PRODUCTS, LLC
Reel/Frame 057654/0396 →
Security Interest
Apr 2, 2026
From: VOIDFORM PRODUCTS, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 074255/0038 →
Security Interest
Apr 2, 2026
From: VOIDFORM PRODUCTS, LLC
To: ROYAL BANK OF CANADA
Reel/Frame 074255/0065 →