Patent Assignment
Reel/Frame 057701/0687
Assignment of Assignor's Interest
Recorded: 2021-10-05
Pages: 5
Assignors
DENG, FELIX
Executed: 2019-06-13
OW, YUEH SHENG
Executed: 2019-06-13
KOH, TUCK FOONG
Executed: 2019-05-09
CHEN, NUNO YEN-CHU
Executed: 2019-06-13
GOH, CLINTON
Executed: 2019-06-13
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property
(1)
Methods and Apparatus for Cleaving of Semiconductor Substrates
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 6, 2021
From: WADA, YUICHI; KESAPRAGADA, SREE RANGASAI V
To: APPLIED MATERIALS, INC.
Reel/Frame 055835/0373 →
Assignment of Assignor's Interest
Oct 7, 2021
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 057726/0648 →