Patent Assignment
Reel/Frame 057716/0518
Merger and Change of Name
Recorded: 2021-10-06
Pages: 3
Assignors
TOHO ENGINEERING CO., LTD.
Executed: 2021-07-15
TOHOKOKI SEISAKUSHO CO., LTD.
Executed: 2021-07-15
Assignee
TOHOKOKI SEISAKUSHO CO., LTD.
38, KOGANE-CHO, YOKKAICHI-SHI, 512-8062, JAPAN
Covered Properties
(4)
Substrate Polishing Apparatus
Planarizing Processing Method and Planarizing Processing Device
Planarization Processing Device
Planarizing Processing Method and Planarizing Processing Device
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 16, 2013
From: SUZUKI, TATSUTOSHI; SUZUKI, EISUKE; SUZUKI, DAISUKE
To: TOHO ENGINEERING CO., LTD.
Reel/Frame 031025/0022 →
Assignment of Assignor's Interest
Jan 24, 2017
From: YAMAUCHI, KAZUTO
To: OSAKA UNIVERSITY
Reel/Frame 041058/0211 →
Assignment of Assignor's Interest
Jan 24, 2017
From: SUZUKI, EISUKE; SUZUKI, TATSUTOSHI; SUZUKI, DAISUKE
To: TOHO ENGINEERING CO., LTD.
Reel/Frame 041466/0256 →
Assignment of Assignor's Interest
Feb 9, 2018
From: SUZUKI, TATSUTOSHI; SUZUKI, EISUKE; SUZUKI, DAISUKE
To: TOHO ENGINEERING CO., LTD.
Reel/Frame 044883/0345 →
Assignment of Assignor's Interest
Dec 20, 2018
From: YAMAUCHI, KAZUTO
To: OSAKA UNIVERSITY
Reel/Frame 047830/0889 →
Assignment of Assignor's Interest
Dec 20, 2018
From: SUZUKI, EISUKE; SUZUKI, TATSUTOSHI; SUZUKI, DAISUKE
To: TOHO ENGINEERING CO., LTD.
Reel/Frame 047969/0874 →