Patent Assignment
Reel/Frame 057734/0812
Assignment of Assignor's Interest
Recorded: 2021-10-07
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method and System for Adjusting Location of a Wafer and a Top Plate in a Thin-Film Deposition Process