Patent Assignment
Reel/Frame 057736/0558
Assignment of Assignor's Interest
Recorded: 2021-10-08
Pages: 9
Assignors
NAKAMURA, TOMONORI
Executed: 2021-09-17
MAEDA, TORU
Executed: 2021-09-14
NAGAI, SATORU
Executed: 2021-09-07
SAEKI, YOSHIHIRO
Executed: 2021-09-29
WATANABE, OSAMU
Executed: 2021-09-24
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Method for Setting Conditions for Heating Semiconductor Chip During Bonding, Method for Measuring Viscosity of Non-Conductive Film, and Bonding Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.