Patent Assignment
Reel/Frame 057746/0712
Assignment of Assignor's Interest
Recorded: 2021-08-30
Pages: 3
Assignors
SONG, JIAN
Executed: 2021-06-16
LI, JUN
Executed: 2021-06-16
PANG, XINGSHOU
Executed: 2021-06-16
HAN, MINGCHUAN
Executed: 2021-06-16
YAO, JINZHONG
Executed: 2021-06-16
XU, XUESONG
Executed: 2021-06-16
Assignee
NXP USA, INC.
6501 WILLIAM CANNON DRIVE, AUSTIN, TEXAS, 78735
Covered Property
(1)
Integrated Circuit Package and Method to Manufacture the Integrated Circuit Package to Reduce Bond Wire Defects in the Integrated Circuit Package