Patent Assignment
Reel/Frame 057750/0769
Assignment of Assignor's Interest
Recorded: 2021-10-11
Pages: 3
Assignors
EOM, JU IL
Executed: 2021-10-06
LEE, WOO JIN
Executed: 2021-10-06
CHO, HYUNG HO
Executed: 2021-10-06
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, 17336, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip Including Chip Pads of Different Surface Areas, and Semiconductor Package Including the Semiconductor Chip