Patent Assignment
Reel/Frame 057760/0289
Assignment of Assignor's Interest
Recorded: 2021-10-12
Pages: 3
Assignor
DUMKA, DEEP C.
Executed: 2019-11-26
Assignee
QORVO US, INC.
7628 THORNDIKE ROAD, GREENSBORO, NORTH CAROLINA, 27409
Covered Property
(1)
Semiconductor Chip Suitable for 2.5D and 3D Packaging Integration and Methods of Forming the Same