Patent Assignment
Reel/Frame 057775/0173
Assignment of Assignor's Interest
Recorded: 2021-10-13
Pages: 4
Assignors
LIU, MONSEN
Executed: 2021-09-22
CHEN, SHUO-MAO
Executed: 2021-09-21
LAI, PO-YING
Executed: 2021-10-13
TSAI, SHANG-LUN
Executed: 2021-09-21
JENG, SHIN-PUU
Executed: 2021-09-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Semiconductor device having an integrated device positioned within a hybrid interposer that includes organic and non-organic materials