IP Library › Assignment 057799/0610
Patent Assignment
Reel/Frame 057799/0610

Assignment of Assignor's Interest

Recorded: 2021-10-14 Pages: 15
Assignors
LEE, JAE UNG
Executed: 2018-04-09
LEE, YUNG WOO
Executed: 2018-04-03
BANG, DONG HYUN
Executed: 2018-06-05
CHOI, WOOK
Executed: 2018-06-05
JEONG, KOOWOONG
Executed: 2018-04-18
KIM, BYONG JIN
Executed: 2018-04-03
SHIN, MIN CHUL
Executed: 2018-05-28
LIM, HO JEONG
Executed: 2018-06-05
KIM, JI HYUN
Executed: 2018-04-18
KIM, CHANG HUN
Executed: 2018-04-20
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Semiconductor Package and Manufacturing Method Thereof
Application: 17/501,857 →
Publication: US 2022/0051973
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 14, 2021
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 057815/0739 →
Assignment of Assignor's Interest Mar 6, 2024
From: CHO, EUNNARA
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 066673/0517 →