Patent Assignment
Reel/Frame 066673/0517
Assignment of Assignor's Interest
Recorded: 2024-03-06
Pages: 15
Assignor
CHO, EUNNARA
Executed: 2024-02-28
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Properties
(3)
Semiconductor Package and Manufacturing Method Thereof
Semiconductor Package and Manufacturing Method Thereof
Semiconductor Package and Manufacturing Method Thereof
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 19, 2018
From: LEE, JAE UNG; LEE, YUNG WOO; BANG, DONG HYUN; CHOI, WOOK
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 046131/0690 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →
Assignment of Assignor's Interest
Oct 16, 2020
From: LEE, JAE UNG; LEE, YUNG WOO; BANG, DONG HYUN; CHOI, WOOK
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 054082/0599 →
Assignment of Assignor's Interest
Oct 14, 2021
From: LEE, JAE UNG; LEE, YUNG WOO; BANG, DONG HYUN; CHOI, WOOK
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 057799/0610 →
Assignment of Assignor's Interest
Oct 14, 2021
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 057815/0739 →