Patent Assignment
Reel/Frame 046131/0690
Assignment of Assignor's Interest
Recorded: 2018-06-19
Pages: 15
Assignors
LEE, JAE UNG
Executed: 2018-04-09
LEE, YUNG WOO
Executed: 2018-04-03
BANG, DONG HYUN
Executed: 2018-06-05
CHOI, WOOK
Executed: 2018-06-05
JEONG, KOOWOONG
Executed: 2018-04-18
KIM, BYONG JIN
Executed: 2018-04-03
SHIN, MIN CHUL
Executed: 2018-05-28
LIM, HO JEONG
Executed: 2018-06-05
KIM, JI HYUN
Executed: 2010-04-18
KIM, CHANG HUN
Executed: 2018-04-20
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →
Assignment of Assignor's Interest
Mar 6, 2024
From: CHO, EUNNARA
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 066673/0517 →