IP Library › Assignment 054082/0599
Patent Assignment
Reel/Frame 054082/0599

Assignment of Assignor's Interest

Recorded: 2020-10-16 Pages: 15
Assignors
LEE, JAE UNG
Executed: 2018-04-09
LEE, YUNG WOO
Executed: 2018-04-03
BANG, DONG HYUN
Executed: 2018-06-05
CHOI, WOOK
Executed: 2018-06-05
JEONG, KOOWOONG
Executed: 2018-04-18
KIM, BYONG JIN
Executed: 2018-04-03
SHIN, MIN CHUL
Executed: 2018-05-28
LIM, HO JEONG
Executed: 2018-06-05
KIM, JI HYUN
Executed: 2018-04-18
KIM, CHANG HUN
Executed: 2018-04-20
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Semiconductor Package and Manufacturing Method Thereof
Application: 16/042,798 →
Publication: US 2018/0350734
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →
Assignment of Assignor's Interest Mar 6, 2024
From: CHO, EUNNARA
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 066673/0517 →