Patent Assignment
Reel/Frame 057809/0325
Assignment of Assignor's Interest
Recorded: 2021-10-15
Pages: 7
Assignors
EID, FERAS
Executed: 2021-09-29
ALEKSOV, ALEKSANDAR
Executed: 2021-10-12
ELSHERBINI, ADEL
Executed: 2021-10-06
BRAUNISCH, HENNING
Executed: 2021-09-29
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Conformal Power Delivery Structures of 3D Stacked Die Assemblies