IP Library › Assignment 057819/0187
Patent Assignment
Reel/Frame 057819/0187

Assignment of Assignor's Interest

Recorded: 2021-10-18 Pages: 7
Assignors
LAI, CHI-HUI
Executed: 2021-10-18
CHUN, SHU-RONG
Executed: 2021-10-18
PAN, KUO-LUNG
Executed: 2021-10-18
KUO, TING HAO
Executed: 2021-10-18
TSAI, HAO-YI
Executed: 2021-10-18
LIU, CHUNG-SHI
Executed: 2021-10-18
YU, CHEN-HUA
Executed: 2021-10-18
LAI, YU-CHIA
Executed: 2021-10-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Integrated Circuit Package and Method
Application: 16/589,758 →
Publication: US 2020/0212018
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 1, 2019
From: LAI, CHI-HUI; CHUN, SHU-RONG; PAN, KUO LUNG; KUO, TIN-HAO
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 050589/0467 →