Patent Assignment
Reel/Frame 057823/0900
Assignment of Assignor's Interest
Recorded: 2021-10-18
Pages: 3
Assignor
CHENG, CHUNG-LIANG
Executed: 2021-06-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Including Backside Conductive Vias