Patent Assignment
Reel/Frame 057825/0625
Assignment of Assignor's Interest
Recorded: 2021-10-18
Pages: 5
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Bonding Apparatus and Method for Correcting Movement Amount of Bonding Head