Patent Assignment
Reel/Frame 057829/0547
Assignment of Assignor's Interest
Recorded: 2021-10-19
Pages: 5
Assignors
WEI, CHIA-YU
Executed: 2018-10-18
LI, CHENG-YUAN
Executed: 2018-10-18
CHEN, HSIN-CHI
Executed: 2018-10-18
LEE, KUO-CHENG
Executed: 2018-10-18
HUANG, HSUN-YING
Executed: 2018-10-18
LIN, YEN-LIANG
Executed: 2018-10-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Anchor Structures and Methods for Uniform Wafer Planarization and Bonding