Patent Assignment
Reel/Frame 057854/0647
Assignment of Assignor's Interest
Recorded: 2021-10-20
Pages: 7
Assignors
PATEL, BAIJU
Executed: 2021-10-12
CHHABRA, SIDDHARTHA
Executed: 2021-07-16
DEWAN, PRASHANT
Executed: 2021-07-16
SHWARTZ, OFIR
Executed: 2021-10-15
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Methods and Apparatuses to Provide Chiplet Binding to a System on a Chip Platform Having a Disaggregated Architecture