Patent Assignment
Reel/Frame 057856/0660
Assignment of Assignor's Interest
Recorded: 2021-10-21
Pages: 6
Assignors
LIN, SHIH-TING
Executed: 2020-06-29
WU, CHI-HSI
Executed: 2021-09-28
YU, CHEN-HUA
Executed: 2020-06-29
LU, SZU-WEI
Executed: 2020-06-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Fabricating the Same