Patent Assignment
Reel/Frame 057890/0447
Assignment of Assignor's Interest
Recorded: 2021-10-25
Pages: 3
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 2430014, JAPAN
Covered Property
(1)
Camera Package, Method for Manufacturing Camera Package, and Electronic Device