Patent Assignment
Reel/Frame 057900/0799
Assignment of Assignor's Interest
Recorded: 2021-10-25
Pages: 6
Assignors
KIM, JONGYOUN
Executed: 2021-09-08
BAE, MINJUN
Executed: 2021-09-08
LEE, HYEONSEOK
Executed: 2021-09-08
JEON, GWANGJAE
Executed: 2021-09-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same