Patent Assignment
Reel/Frame 057906/0460
Assignment of Assignor's Interest
Recorded: 2021-10-26
Pages: 4
Assignor
WU, YULEI
Executed: 2021-09-29
Assignee
CHANGXIN MEMORY TECHNOLOGIES, INC.
NO. 388, XINGYE AVENUE, AIRPORT INDUSTRIAL PARK,ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA,, HEFEI, CHINA
Covered Property
(1)
Method for Forming Connecting Pad and Semiconductor Structure