Patent Assignment
Reel/Frame 057917/0979
Assignment of Assignor's Interest
Recorded: 2021-10-26
Pages: 4
Assignors
KAO, MIN-FENG
Executed: 2021-05-13
LIN, HSING-CHIH
Executed: 2021-05-12
LIU, JEN-CHENG
Executed: 2021-06-14
YAUNG, DUN-NIAN
Executed: 2021-07-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Through Silicon Vias and Methods of Fabricating Thereof