Patent Assignment
Reel/Frame 057938/0059
Assignment of Assignor's Interest
Recorded: 2021-10-27
Pages: 12
Assignors
ALEKSOV, ALEKSANDAR
Executed: 2021-06-10
KAMGAING, TELESPHOR
Executed: 2021-06-09
PRABHU GAUNKAR, NEELAM
Executed: 2021-06-14
DOGIAMIS, GEORGIOS C.
Executed: 2021-06-09
STRONG, VERONICA
Executed: 2021-06-09
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Glass-Based Cavity and Channels for Cooling of Embedded Dies and 3D Integrated Modules Using Package Substrates with Glass Core
Application:
17/349,695 →
Publication:
US 2022/0406686