Patent Assignment
Reel/Frame 057946/0255
Assignment of Assignor's Interest
Recorded: 2021-10-28
Pages: 5
Assignors
LIEW, SOON LEE
Executed: 2021-10-22
WOO, ENG WAH
Executed: 2021-10-20
KOMPOSCH, ALEXANDER
Executed: 2021-10-21
Assignee
CREE, INC.
4600 SILICON DRIVE, DURHAM, NORTH CAROLINA, 27703
Covered Property
(1)
Methods of Forming Packaged Semiconductor Devices and Leadframes for Semiconductor Device Packages
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.