Patent Assignment
Reel/Frame 057951/0672
Assignment of Assignor's Interest
Recorded: 2021-10-28
Pages: 6
Assignors
CHOI, YOUNSEOK
Executed: 2021-09-07
PARK, BYUNGSUN
Executed: 2021-09-07
LEE, YOUNGIL
Executed: 2021-09-07
LEE, JAECHUL
Executed: 2021-09-09
IM, JIWOON
Executed: 2021-09-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Having Doped Interlayer Insulating Layer