Patent Assignment
Reel/Frame 057951/0726
Assignment of Assignor's Interest
Recorded: 2021-10-28
Pages: 6
Assignors
NOH, HYUNGGYUN
Executed: 2021-09-14
BAE, GUN-HEE
Executed: 2021-09-14
PAE, SANGWOO
Executed: 2021-09-14
BAE, JINSOO
Executed: 2021-09-14
CHOI, DEOK-SEON
Executed: 2021-09-14
CHOI, IL-JOO
Executed: 2021-09-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Device