Patent Assignment
Reel/Frame 057960/0358
Assignment of Assignor's Interest
Recorded: 2021-10-29
Pages: 6
Assignors
YANG, DEOKKYUNG
Executed: 2017-09-15
LEE, HUNTEAK
Executed: 2017-09-15
KIM, SUNGSOO
Executed: 2017-09-15
LEE, HEESOO
Executed: 2017-09-15
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Embedded Die Substrate, and System-in-Package Modules with the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.