Patent Assignment
Reel/Frame 057981/0330
Assignment of Assignor's Interest
Recorded: 2021-11-01
Pages: 3
Assignors
TSAI, YI-LIN
Executed: 2021-10-28
LIU, NAI-WEI
Executed: 2021-10-28
HSU, WEN-SUNG
Executed: 2021-10-28
Assignee
MEDIATEK INC.
NO. 1, DUSING 1ST RD., HSINCHU SCIENCE PARK, HSINCHU CITY, 30078, TAIWAN
Covered Property
(1)
Semiconductor Package Having an Interposer in Which One or More Dies Are Formed and Method of Forming the Same