Patent Assignment
Reel/Frame 057994/0103
Assignment of Assignor's Interest
Recorded: 2021-11-02
Pages: 7
Assignors
HWANG, SONKWAN
Executed: 2021-09-09
KIM, TAESEONG
Executed: 2021-09-09
NA, HOONJOO
Executed: 2021-09-09
MOON, KWANGJIN
Executed: 2021-09-09
JEON, HYUNGJUN
Executed: 2021-09-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Through via Structure