Patent Assignment
Reel/Frame 057998/0707
Assignment of Assignor's Interest
Recorded: 2021-11-02
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Forming Package Structure