Patent Assignment
Reel/Frame 058017/0194
Assignment of Assignor's Interest
Recorded: 2021-11-04
Pages: 7
Assignors
POPOVIC, DARKO
Executed: 2021-10-24
LISK, DURODAMI
Executed: 2021-10-24
LI, YUE
Executed: 2021-10-31
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
Multiple (Multi-) Die Integrated Circuit (Ic) Packages for Supporting Higher Connection Density, and Related Fabrication Methods