Patent Assignment
Reel/Frame 058017/0525
Assignment of Assignor's Interest
Recorded: 2021-11-04
Pages: 7
Assignors
GANDHI, JASPREET S.
Executed: 2014-05-13
HUANG, WAYNE H.
Executed: 2014-05-14
DERDERIAN, JAMES M.
Executed: 2014-05-14
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Interconnect Structure with Improved Conductive Properties and Associated Systems and Methods
Application:
15/788,094 →
Publication:
US 2018/0040592
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 6 to Patent Security Agreement
Nov 1, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 044348/0253 →
Supplement No. 6 to Patent Security Agreement
Nov 1, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 044653/0333 →
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest
Jul 20, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 046597/0333 →
Release of Security Interest
Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050709/0838 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →