Patent Assignment
Reel/Frame 058021/0897
Assignment of Assignor's Interest
Recorded: 2021-11-04
Pages: 8
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Bonding Apparatus, Bonding System, and Bonding Method