Patent Assignment
Reel/Frame 058051/0204
Assignment of Assignor's Interest
Recorded: 2021-11-08
Pages: 16
Assignors
YANG, JIN
Executed: 2021-09-14
CHUANG, JIMMY
Executed: 2021-09-25
LIU, MENGQI
Executed: 2021-10-10
GENG, PHIL
Executed: 2021-09-15
MIELE, RALPH V.
Executed: 2021-09-25
AHUJA, SANDEEP
Executed: 2021-10-07
SHIA, DAVID
Executed: 2021-09-15
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Thermally Conductive Chamber with Stiffening Structure for Thermal Cooling Assembly of Semiconductor Chip Package Under High Loading Force