Patent Assignment
Reel/Frame 058067/0685
Assignment of Assignor's Interest
Recorded: 2021-11-10
Pages: 6
Assignors
DING, SHAOFENG
Executed: 2021-10-10
MOON, SUNGWOOK
Executed: 2021-11-01
AHN, JEONGHOON
Executed: 2021-11-01
CHOI, YUNKI
Executed: 2021-10-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip and Semiconductor Package Including Same