Patent Assignment
Reel/Frame 058070/0079
Assignment of Assignor's Interest
Recorded: 2021-11-10
Pages: 3
Assignors
CHEN, JIA SHIANG
Executed: 2021-10-27
LAN, CHUNG-YU
Executed: 2021-10-27
CHEN, YU-SHEN
Executed: 2021-10-27
Assignee
UNIMICRON TECHNOLOGY CORP.
NO.179, SHANYING ROAD, GUISHAN DISTRICT, TAOYUAN CITY, TAIWAN
Covered Property
(1)
Package Structure with Interconnection Between Chips and Packaging Method Thereof