Patent Assignment
Reel/Frame 058092/0610
Assignment of Assignor's Interest
Recorded: 2021-11-12
Pages: 3
Assignee
CORETRONIC CORPORATION
NO. 11, LI-HSIN RD., HSINCHU SCIENCE PARK,, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Bonding Method for Electronic Element