Patent Assignment
Reel/Frame 058101/0511
Assignment of Assignor's Interest
Recorded: 2021-11-12
Pages: 5
Assignors
HUANG, SHIQI
Executed: 2019-10-21
LIU, WEI
Executed: 2019-10-21
CHELON, BATER
Executed: 2019-10-21
HU, SIPING
Executed: 2019-10-23
Assignee
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
18 GAOXIN 4TH ROAD, EAST LAKE HIGH-TECH DEVELOPMENT ZONE, WUHAN, HUBEI, CHINA
Covered Property
(1)
Method for Forming a Three-Dimensional (3D) Memory Device Having Bonded Semiconductor Structures