Patent Assignment
Reel/Frame 058109/0611
Assignment of Assignor's Interest
Recorded: 2021-11-15
Pages: 6
Assignors
TANEDA, HIROSHI
Executed: 2021-11-01
IMAFUJI, KEI
Executed: 2021-11-01
AKIYAMA, YOSHIKI
Executed: 2021-11-01
UCHIDA, KENSUKE
Executed: 2021-11-01
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO-KEN, 381-2287, JAPAN
Covered Property
(1)
Wiring Substrate and Semiconductor Device